VISEMI Webinar Series
Demystifying Semiconductors
The first-ever in-depth semiconductor webinar series delivered entirely in Vietnamese — featuring world-class experts from NVIDIA, Broadcom, TSMC, AMD, Intel, Samsung, Qualcomm, and more.
8 Episodes Aired
Vietnamese
Free to Attend
A Series Like No Other
Vietnam's deepest dive into the global chip industry — in Vietnamese.
- 35.5K Total webinar views
- ~3K Live attendees per session
- 14 Total sessions planned
- ~2.5hr Per session
- 100% Free & live
The VISEMI Approach
A mysterious map — now decoded.
- 01
The semiconductor industry can feel like a “mysterious map” — and VISEMI is here to help you navigate it.
- 02
Through this live webinar series, each session reveals a new part of the global semiconductor landscape — delivered by world-class experts with deep knowledge and real-world experience.
- 03
Piece by piece, participants connect the dots, uncover how each part of the industry fits together, and discover exciting, global career opportunities.
A connected ecosystem — from design to delivery
Speakers from leading global corporations
- NVIDIA
- Broadcom
- TSMC
- AMD
- Intel
- Samsung
- Qualcomm
- Marvell
- ASM
- CoAsia
- Qorvo
- Applied Materials
+ academic lecturers and researchers from leading institutions across the United States, Europe, Singapore, Japan, Taiwan, South Korea, and beyond.
Who joins
Built for an entire generation
- Semiconductor professionals
- University students
- High-school students
- Educators
- Parents
- Entrepreneurs
- Tech enthusiasts
What you'll explore
Five themes in fourteen episodes
- 01
The Industry
Core technologies and global development opportunities, explained clearly.
- 02
The Ecosystem
Key components — and how they work together.
- 03
The Roles
What semiconductor engineers and professionals actually do.
- 04
The Careers
Pathways and professional growth in the field.
- 05
The Future
Challenges and opportunities on the horizon.
The 14-Episode Lineup
Explore the full series
From the silicon wafer to the AI chip — every session, in Vietnamese, available on demand or coming live.
Speakers 3
Dr. Bình Phạm Architect · NVIDIA
Dr. Bình Phạm is an Architect at NVIDIA, specializing in SoC (System on Chip) design for NVIDIA's server, client, and automotive products, where he optimizes the operation of the different chip blocks on an SoC such as CPU and GPU. Before NVIDIA, he worked at Intel's research labs, focusing on CPU core development and optimizing the memory subsystem for networking and AI applications.
Dr. Đăng Trịnh Technical Manager, Thin-Film R&D · TSMC
Dr. Đăng Trịnh (Trịnh Hải Đăng) has over 15 years of experience in semiconductor materials and device research and development. He currently works at Taiwan Semiconductor Manufacturing Company (TSMC) as a technical manager in thin-film R&D. His research focuses on developing emerging non-volatile memories (RRAM, MRAM, PCRAM, FERAM), high-density capacitors (MIM), and GaN-based devices for applications in AI, the automotive industry, smartphones, and IoT. He holds numerous patents and has authored many research papers in international journals.
Dr. Lan Vũ Principal Engineer · Broadcom
Dr. Lan Vũ is currently a Principal Engineer at Broadcom. Her work focuses on researching and developing solutions to optimize AI infrastructure in the data center for large enterprises. She is one of the pioneers of GPU virtualization technology that helps reduce AI infrastructure costs, with over 15 years of experience in High Performance Computing on large-scale computer systems and more than 20 years researching and applying AI, Machine Learning, and Data Mining across many different fields. Dr. Lan Vũ is also the author of 25 U.S. technology patents and dozens of scientific research papers. In addition, she has a passion for composing music as a hobby alongside her passion for technology.
Speakers 3
Dr. Công Trịnh Senior Engineering Manager · Applied Materials
Dr. Công Trịnh earned his Ph.D. in Chemistry from the University of Southern California, with a research focus on advanced nanomaterials. After graduating, he pursued an engineering career in the semiconductor industry, accumulating more than 10 years of experience in thin-film process development (CVD) and atomic layer deposition (ALD) technology. He currently serves as an engineering manager at Applied Materials, where he leads cross-functional teams from early-stage research through to high-volume manufacturing, combining strategic thinking, deep technical expertise, and a passion for education and innovation. He holds nearly 20 patents in the field of nanomaterials and semiconductor technology.
Dr. Minh Trần VP of Research · Nexus Photonics
Dr. Minh Trần is Vice President of Research at Nexus Photonics, a pioneering U.S. photonic chip company. He studied Electrical Engineering at the University of Tokyo and completed his Ph.D. at UC Santa Barbara, California. He has advanced the field of integrated photonic circuits, setting several records and publishing research in the scientific journals Nature and Science, and holding numerous patents in heterogeneous photonic integration, narrow-linewidth lasers, and high-quality-factor resonators.
Mr. Dương Minh Tiến Product Development Engineer · Samsung
Mr. Dương Minh Tiến earned his Master's degree from RMIT University (Australia) as an Intel scholar, and completed his undergraduate studies in Electronics and Telecommunications at Ho Chi Minh City University of Technology. He is currently a product development engineer at Samsung in South Korea, specializing in FCBGA substrate development for server chips, AI chips, networking chips, and automotive chips. Prior to Samsung, he was an engineering manager at Intel Products Vietnam, focusing on packaging engineering for CPUs and chipsets.
Speakers 4
Dr. Minh Trần VP of Research · Nexus Photonics
Dr. Minh Trần is Vice President of Research at Nexus Photonics, a pioneering U.S. photonic chip company. He studied Electrical Engineering at the University of Tokyo and completed his Ph.D. at UC Santa Barbara, California. He has advanced the field of integrated photonic circuits, setting several records and publishing research in the scientific journals Nature and Science, and holding numerous patents in heterogeneous photonic integration, narrow-linewidth lasers, and high-quality-factor resonators.
Dr. Sơn Lê Director, System Integration & Test · Nubis Communications
Dr. Sơn Lê (Lê Thái Sơn) is currently the Director of System Integration and Test at Nubis Communications (New Jersey, USA), with deep expertise in the design and measurement of optical transmission systems. Before his current role at Nubis, he was a technical staff member at Nokia Bell Labs from 2016 to 2022, where he conducted research on high-speed optical transmission systems, including direct-detection technology for data centers and coherent detection for metro and long-haul networks. At Nokia, he helped develop the coherent 400G-800G digital signal processor (DSP) (PSE-V) and designed the first Gbps-rate Optical Supervisory Channel (OSC) with polarization tracking capability. He is a frequent speaker at leading optical communications conferences such as OFC and ECOC, and he has published more than 120 scientific papers and holds more than 10 patents in the fields of optical transmission and 5G/6G mobile access networks. He was named "Innovator of the Year in Germany 2018" and an "Innovator Under 35 for Europe" by MIT Technology Review, and in 2018 he also received the Best Paper Award from the German Information Technology Society (ITG).
Dr. Tùng Hà Principal Scientist & Deputy Head, Advanced Optical Technology · A*STAR
Dr. Tùng Hà (Tony) earned his Ph.D. (2018) in Applied Physics from the School of Physical and Mathematical Sciences at Nanyang Technological University (NTU), Singapore. He currently serves as Principal Scientist and Deputy Head of Advanced Optical Technology, leading a team of approximately 50 scientists and engineers. He was recently appointed project lead at the National Semiconductor Translation and Innovation Centre (NSTIC) — a new national platform in Singapore aimed at bringing advanced semiconductor technologies from the lab into real-world applications and strengthening the island nation's semiconductor industry capabilities. Dr. Tùng has published more than 50 scientific papers and international patents, with roughly 5,500 total citations and an h-index of 27, and his research has been published and highlighted in the world's leading scientific journals such as Science, Nature Nanotechnology, Nature Photonics, and Advanced Materials. His work has earned broad global recognition through numerous prestigious awards, including the Young Individual Research Grant Award (2021, Singapore), Next ASEAN Innovator (2023, Korea's Ministry of Science and ICT), the Discovery Early Career Researcher Award (2024, Australian Research Council), and Rising Stars in Optics (2024, Journal of Optics, IOP Science, United Kingdom).
Dr. Thăng Phạm Optical Network Architect · Nexthop AI
Dr. Thăng Phạm holds a Ph.D. in Photonics Engineering from the Technical University of Denmark (Denmark). He is currently an Optical Network Architect at the startup Nexthop AI, which specializes in researching and designing solutions to optimize AI network infrastructure for hyperscalers such as Microsoft, Oracle, and Meta. Before Nexthop AI, Dr. Thăng worked at Omniva, Meta, and Finisar, specializing in the development of high-speed optical interconnect systems within data centers.
Speakers 4
Dr. Lê Quang Đạm General Manager · Marvell Technology Vietnam
Dr. Lê Quang Đạm is the General Manager of Marvell Technology Vietnam. He previously served as Engineering Director, Senior Director, and Associate Vice President at Marvell Technology. Earlier in his career, he was a Senior Scientist at Broadcom, a Senior Manager at ATI Technologies, Chief Architect at Gennum Corporation, and an Algorithm Design Specialist at Miranda Technologies.
Mr. Trịnh Khắc Huề General Manager · Qorvo Vietnam
Mr. Trịnh Khắc Huề (Harry) is the General Manager of Qorvo Vietnam, with more than 20 years of experience in the semiconductor industry. He is an expert in Analog and Mixed-signal IC design. Throughout his career, he has consistently been a model of innovative leadership backed by deep technical expertise.
Mr. Nguyễn Thanh Yên General Manager · CoAsia SEMI Vietnam
Mr. Nguyễn Thanh Yên graduated from Hanoi University of Science and Technology with a degree in Electronics and Telecommunications in 2005, and earned a Master of Science in IC engineering from the National University of Singapore in 2012. Before becoming Chief Engineer and later General Manager at his current company, CoAsia SEMI Vietnam, he founded the LSI unit at FPT Software, providing IC design services to international clients, where he successfully built, managed, operated, and grew a team of 130 IC design engineers from scratch in just three years. From 2008 to 2014, he worked at Infineon Technologies, responsible for designing high-performance analog circuits for power-conversion products and 32-bit microcontrollers used in automotive applications. Before 2008, he worked at Active-Semi — now Qorvo Vietnam — as an analog IC design engineer for power-management products. He is also an administrative board member of the Vietnam IC engineering community, which has more than 32,000 members, and is highly active in developing the Vietnamese IC community through writing articles, organizing online and in-person webinars, and running free "Chip Design" training courses for students seeking to strengthen their foundational knowledge of IC design.
Mr. Dương Minh Tiến Product Development Engineer · Samsung
Mr. Dương Minh Tiến earned his Master's degree from RMIT University (Australia) as an Intel scholar, and completed his undergraduate studies in Electronics and Telecommunications at Ho Chi Minh City University of Technology. He is currently a product development engineer at Samsung in South Korea, specializing in FCBGA substrate development for server chips, AI chips, networking chips, and automotive chips. Prior to Samsung, he was an engineering manager at Intel Products Vietnam, focusing on packaging engineering for CPUs and chipsets.
Speakers 4
Dr. Nhàn Trần Co-founder & CTO · Nanochap Electronics
Dr. Nhàn Trần is the Co-founder and Chief Technology Officer (CTO) of Nanochap Electronics, which operates across Australia, China, and Vietnam. He began his research career as a Research Fellow at the Centre for Neural Engineering, University of Melbourne (Australia), where he was a core member of Bionic Vision Australia, contributing to the development of a high-resolution artificial retina aimed at restoring sight for the visually impaired. With more than 20 years of experience in R&D and industrial integrated circuit (IC) design, Dr. Nhàn is recognized as a pioneer at the intersection of electronics and biomedical engineering; his research has been published in leading journals including the IEEE Journal of Solid-State Circuits (JSSC), and he serves as a reviewer for prestigious international conferences such as EMBC, BioCAS, and ISCAS. As Co-founder and CTO of Nanochap Electronics, he led his team to successfully develop a high-resolution artificial retina that is ready for clinical trials following multiple rigorous stages of animal testing. He has also guided his team from design through mass production and commercialization of numerous ICs for implantable and wearable biomedical products, including continuous glucose monitoring (CGM) devices, EEG/ECG/EMG/PPG signal acquisition and analysis systems, highly programmable electrical neural stimulation (ENS), and brain-computer interfaces (BCI).
Assoc. Prof. Phạm Nguyễn Thanh Loan Associate Professor, School of Electrical & Electronic Engineering · Hanoi University of Science & Technology (HUST)
Assoc. Prof. Phạm Nguyễn Thanh Loan spent nearly a decade living and studying in France before joining the School of Electrical and Electronic Engineering at Hanoi University of Science and Technology, where her years of study and scientific research in France left her with many valuable lessons and experiences. She graduated from École Centrale de Lyon, France, majoring in Electronics and Communication Systems in 2005, earned a Master's degree in Electronics specializing in Micro and Nano Electronics from Joseph Fourier University, France, in 2007, and completed her Ph.D. in Electronics specializing in Micro and Nano Electronics at the Institut Polytechnique de Grenoble, France, in 2010. Her primary research directions are the research and design of analog integrated circuits (analog ICs) for low-power receiver front-ends in IoT and biomedical applications, as well as analog ICs for high-efficiency power circuits. She has published 52 scientific papers, including 12 in prestigious international journals, and she has been granted a patent for a system for measuring and analyzing electromyographic signals using graphene-based sensors. She has also published two books with reputable publishers and served on the development councils for the integrated training program in Electronics and Telecommunications and for the curriculum on intelligent embedded systems and IoT.
Mr. Phạm Minh Hiếu Ph.D. Researcher · UC San Diego
Mr. Phạm Minh Hiếu received his Master's degree in Electrical and Computer Engineering from the University of California, San Diego (La Jolla, California, USA) in 2022, and his Bachelor of Engineering in Electronics and Telecommunications from Hanoi University of Science and Technology (HUST), Vietnam, in 2020. He is currently pursuing his Ph.D. at the University of California, San Diego. His current research areas include integrated power electronics, power amplifier architectures for 5G/6G networks, switched-capacitor converters, and power delivery and management systems for high-performance computing (HPC).
Mr. Nguyễn Thanh Yên General Manager · CoAsia SEMI Vietnam
Mr. Nguyễn Thanh Yên graduated from Hanoi University of Science and Technology with a degree in Electronics and Telecommunications in 2005, and earned a Master of Science in IC engineering from the National University of Singapore in 2012. Before becoming Chief Engineer and later General Manager at his current company, CoAsia SEMI Vietnam, he founded the LSI unit at FPT Software, providing IC design services to international clients, where he successfully built, managed, operated, and grew a team of 130 IC design engineers from scratch in just three years. From 2008 to 2014, he worked at Infineon Technologies, responsible for designing high-performance analog circuits for power-conversion products and 32-bit microcontrollers used in automotive applications. Before 2008, he worked at Active-Semi — now Qorvo Vietnam — as an analog IC design engineer for power-management products. He is also an administrative board member of the Vietnam IC engineering community, which has more than 32,000 members, and is highly active in developing the Vietnamese IC community through writing articles, organizing online and in-person webinars, and running free "Chip Design" training courses for students seeking to strengthen their foundational knowledge of IC design.
Speakers 4
Dr. Cương Nguyễn Principal Engineer · Samsung Electronics
Dr. Cương Nguyễn (Nguyễn Thành Cương) is currently a Principal Engineer at Samsung Electronics in South Korea. His work focuses on the research and development of materials and semiconductor manufacturing processes for advanced chips in both Foundry and Memory, using computer-based simulation and computational methods. With more than 16 years of experience in research and development, he is also the author of numerous scientific papers in international journals as well as the holder of many patents.
Dr. Hiệp Dương Senior R&D Engineer · ASM International
Dr. Hiệp Dương (Dương Đình Hiệp) is currently a Senior R&D Engineer at ASM International, one of the world's leading companies in thin-film deposition technologies, including chemical vapor deposition (CVD), atomic layer deposition (ALD), and epitaxy (Epi). At present, he and his team are developing PEALD technology using ICP Plasma — the latest generation of advanced ALD — to meet sub-2nm technology standards, serving major ASM customers such as TSMC, Intel, and Samsung. Before joining ASM International, Hiệp built his career as an R&D process engineer at Micron Technology, a leading corporation in memory manufacturing (DRAM, HBM, and more); after completing his PhD, he was responsible for developing plasma etching and cleaning processes, helping to improve final performance on 300mm wafer products. He earned an Honors Bachelor's degree in Physics from the University of Science – Vietnam National University Ho Chi Minh City (VNUHCM–HCMUS), then received a Master's degree in Materials Science from the Japan Advanced Institute of Science and Technology (JAIST) and completed a PhD in Physical Electronics at the Tokyo Institute of Technology (Tokyo Tech). He has many years of experience in the semiconductor field, particularly in spintronics, DRAM, MRAM, and thin-film deposition technology.
Dr. Lực Lê R&D Engineer · Intel
Dr. Lực Lê completed his undergraduate studies at the University of Texas at Austin, where he earned degrees in Chemical Engineering and Chemistry. During his studies, he took part in research on atomic layer deposition, developing thin-film coatings to protect active electrodes in water-splitting applications. He went on to earn a PhD in Materials Science and Engineering at Georgia Tech, where his graduate research focused on creating recyclable thermoset epoxy materials and improving their mechanical properties using nano-cellulose fillers; his work combined polymer chemistry and materials engineering to advance high-performance yet more sustainable composite materials. After completing his doctorate, Lực joined Intel as an R&D engineer in the Wet Etch module, where he works closely with equipment suppliers to evaluate new chemistries for the toolset and to develop advanced cleaning processes along with selective metal etch processes. His work supports the development of the next generation of Gate-All-Around transistors for Intel's 18A and 14A technology nodes.
Dr. Công Trịnh Senior Engineering Manager · Applied Materials
Dr. Công Trịnh earned his Ph.D. in Chemistry from the University of Southern California, with a research focus on advanced nanomaterials. After graduating, he pursued an engineering career in the semiconductor industry, accumulating more than 10 years of experience in thin-film process development (CVD) and atomic layer deposition (ALD) technology. He currently serves as an engineering manager at Applied Materials, where he leads cross-functional teams from early-stage research through to high-volume manufacturing, combining strategic thinking, deep technical expertise, and a passion for education and innovation. He holds nearly 20 patents in the field of nanomaterials and semiconductor technology.
Speakers 5
Ms. Bích-Yến Nguyễn IEEE Fellow · Chair, vsap lab · Senior Advisor · Soitec
Ms. Bích-Yến Nguyễn is an IEEE Fellow and Chair of vsap lab. She also serves as a Senior Advisor at Soitec in France.
Mr. Bảo-Anh Nguyễn Co-founder & CEO/COO · vsap lab
Mr. Bảo-Anh Nguyễn is one of Vietnam's rare technical experts and leaders to have gone deeply into advanced packaging, multi-die/chiplet integration, and high-speed interconnect technologies — the core building blocks of the modern semiconductor industry. With nearly 20 years of experience in the field, he has held key technical leadership positions at Synopsys Vietnam, where he built and led teams developing multi-die & chiplet products (D2D, UCIe), and at Mixel Vietnam (later acquired by Silvaco), where he served as General Director. During this time he built and led a team of more than 200 engineers in Vietnam and over 500 engineers globally, directly developing chiplet & interconnect IP that has been put into production and is now used in HPC, AI, and Cloud Data Center systems. Since 2014, he has also been a core technical contributor to numerous global technology standards, including HBM, OpenHBI, AIB, and UCIe, and is an active member of JEDEC, the UCIe Consortium, and the Open Compute Project (OCP); earlier, he led the development of high-speed interconnect IP such as DDR, MIPI, LVDS, and Memory Compiler — foundational IP present in most of today's mobile and computing SoCs. As Co-Founder & CEO/COO of vsap lab, he is now pursuing a clear goal: to build Vietnam's first world-class Advanced Packaging Lab Fab ecosystem, connecting research, design, and manufacturing to step by step bring Vietnam more deeply into the global semiconductor value chain. In parallel, he is a co-founder and administrator of the Vietnam IC Community — currently the largest semiconductor engineering community in Vietnam, playing an important role in connecting knowledge, people, and career opportunities for the young generation of engineers.
Mr. Hải-Âu Huỳnh Director of Product Design & Engineering, Co-founder · vsap lab
Mr. Hải-Âu Huỳnh is among Vietnam's experienced engineers, with a long journey of growth in the semiconductor IC field — from physical design and circuit design to complex package design for high-performance systems. He graduated as an Electronics & Telecommunications Engineer from Đà Nẵng University of Science and Technology in 2007. Over 17 years of work, he continually broadened his technical foundation across many technology layers — from physical design and circuit design to advanced package design — at eSilicon (the company later acquired by Synopsys in 2020). From 2020, he continued at Synopsys Vietnam as a Principal Engineer, focusing on the design of advanced packaging technologies; during this period he directly led and successfully managed numerous large-scale 2.5D package tape-out projects, including HBM PHY, OpenHBI, AIB, UCIe, Silicon interposer, RDL interposer, EMIB, and FCBGA — technologies in active use today in the world's leading AI, HPC, and data center systems, which demand high integration and extremely rigorous control of signal, power, and heat. He currently serves as Director of Product Design & Engineering at vsap lab, focusing on developing 2D, 2.5D, and 3D Advanced Packaging technologies, and is a co-founder of vsap lab — an effort aimed at building world-class advanced packaging design and deployment capabilities in Vietnam. Beyond his industry work, he is also active in academic research, with scientific publications in IEEE, reflecting his ability to connect research, design, and manufacturing — a key factor in the modern semiconductor industry.
Mr. Phan Hoàng Hải R&D Staff Engineer · Qualcomm
Mr. Phan Hoàng Hải is among the experienced engineers in the semiconductor industry, currently based in Europe at Qualcomm in Munich, with more than 8 years of experience focused on developing increasingly compact yet highly reliable packaging technologies for BAW and SAW filters — key components in today's 4G and 5G systems and the 6G systems of the future. In his role at Qualcomm, he directly leads the design and reliability analysis of new generations of packaging technology and is responsible for building package design rules. He also works closely with global process and design teams to bring technology from concept to real production — work that sits precisely at the intersection of design, technology, and manufacturing, where every engineering decision directly affects a product's performance, durability, and commercial viability. His semiconductor journey began at IMTEK – University of Freiburg in Germany, where he pursued a Master's in Microsystems Engineering. Alongside his studies, he took part in the prototype-development phase of startups such as muVaP and Phaseform — companies applying semiconductor fabrication technology to micro-pumps and micro-optics — an experience that gave him an early mindset for taking technology from the lab to real products.
Mr. Dương Minh Tiến Product Development Engineer · Samsung
Mr. Dương Minh Tiến earned his Master's degree from RMIT University (Australia) as an Intel scholar, and completed his undergraduate studies in Electronics and Telecommunications at Ho Chi Minh City University of Technology. He is currently a product development engineer at Samsung in South Korea, specializing in FCBGA substrate development for server chips, AI chips, networking chips, and automotive chips. Prior to Samsung, he was an engineering manager at Intel Products Vietnam, focusing on packaging engineering for CPUs and chipsets.
Speakers 4
Prof. Phạm Nam Hải Professor & Deputy Dean, Electrical & Electronic Engineering · Tokyo University of Science
Prof. Phạm Nam Hải is currently the Deputy Dean of Electrical and Electronic Engineering at the Tokyo University of Science (formerly the Tokyo Institute of Technology). He is a specialist in spintronics — spin-based electronics — researching how to harness the spin properties of electrons to develop next-generation electronic devices and data-storage technologies. His research spans ferromagnetic nanoclusters and semiconductor materials, ferromagnet/semiconductor hybrid structures, and topological insulators and topological semimetals, with many potential applications in spintronics and artificial intelligence. Beyond his research, he is also actively involved in the international scientific community: he is a representative member of the Japan Society of Applied Physics and has held several editorial roles at the Magnetics Society of Japan (MSJ), including Editor-in-Chief for the field of Spintronics, and he has served on the program committees of major scientific conferences such as the Conference on Magnetism and Magnetic Materials (MMM). As a research director for projects of the Japan Science and Technology Agency, he has collaborated with numerous industrial R&D groups at Kioxia, TDK, Samsung, and Western Digital. His scientific contributions have been recognized through many awards, including the SSDM Young Researcher Award (2009), the Ando Memorial Award (2014), the Marubun Research Award (2017), the German Innovation Award – Gottfried Wagener Prize (2019), Asian Scientist 100 (2020), and the MSJ Outstanding Research Award (2020).
Dr. Hoàng Thanh Tùng Principal Engineer & Engineering Manager · AMD
Dr. Hoàng Thanh Tùng is currently a Principal Engineer and Engineering Manager at AMD (USA), specializing in power architecture and hardware/software co-design optimization for next-generation GPUs and AI-accelerating NPUs — the critical computing platforms of the AI era. Before joining AMD, he held a range of engineering and R&D positions at technology companies including Samsung SARC/ACL, Neuralink, Micron, and Western Digital, where he focused on AI/ML SoCs (System on Chip), on-chip fabric interconnects, compute accelerators, and memory systems. His research and designs have been incorporated into numerous industrial products such as the Samsung S26, the Micron DLA SoC, the OpenTian security chip, and many tape-out chip designs developed through collaborations with NIST and universities. He earned his Ph.D. in Computer Engineering from Chalmers University of Technology (Sweden) in 2013 and conducted postdoctoral research at the University of Chicago and Argonne National Laboratory. He currently holds 15 granted patents and has received numerous research honors, including the Silver Leaf Award Paper at the PRIME 2012 conference, the Ericsson Research Award 2013, and the ERCIM Alain Bensoussan Fellowship 2013.
Dr. Trịnh Duy Tân Senior Manager · Western Digital
Dr. Trịnh Duy Tân is a co-founder of the VISEMI Foundation — a non-profit organization dedicated to connecting and unlocking the potential of Vietnamese people in the rapidly growing global semiconductor industry. He currently works at Western Digital Corporation as a Senior Manager and holds 7 US patents in the field of magnetic data storage. He earned his Ph.D. in Mechanical and Aerospace Engineering from the University of California San Diego (UC San Diego). Alongside his work in the semiconductor industry, he has a strong passion for mentoring and supporting young Vietnamese people pursuing careers in high technology; through the VISEMI Foundation, he and his colleagues are building a community of knowledge, connecting experts, and creating opportunities for the next generation of Vietnamese semiconductor engineers. Beyond his technical and community work, Dr. Trịnh Duy Tân is also passionate about photography, often capturing moments of everyday life through his lens with a creative eye and attention to detail.
Dr. Công Trịnh Senior Engineering Manager · Applied Materials
Dr. Công Trịnh earned his Ph.D. in Chemistry from the University of Southern California, with a research focus on advanced nanomaterials. After graduating, he pursued an engineering career in the semiconductor industry, accumulating more than 10 years of experience in thin-film process development (CVD) and atomic layer deposition (ALD) technology. He currently serves as an engineering manager at Applied Materials, where he leads cross-functional teams from early-stage research through to high-volume manufacturing, combining strategic thinking, deep technical expertise, and a passion for education and innovation. He holds nearly 20 patents in the field of nanomaterials and semiconductor technology.
Read on Giáo Dục Thời Đại“
As Seen In
Experts Share Knowledge on the “Backbone” of Semiconductor Manufacturing
VISEMI Foundation's webinar on chip foundry — the core manufacturing stage of the semiconductor industry — earned in-depth coverage praising the technical depth and effort of the VISEMI team.
Giáo Dục Thời Đại
December 8, 2025
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